FLUX SFD-231 Флюс 45 г BGA ПАЯЛЬНАЯ ПАСТА

Feature:

1. High Performance: Has strong continuous printing performance, suitable for fine pitch IC and BGA and relatively accuracy components welding

2. Easy to Use: This low temperature solder paste has good wetting and mold release, and is resistant to cold slump, hot slump and drying

3. Application: Suitable for PCB welding of various high demand materials, and rarely phenomenons of tin tombstone displacement

4. Less Residue: Full and bright tin beads on tin, less residue, white and transparent, no fluorine and other extremely corrosive substances

5. Basic Specifications: The particles are 25‑45um (No. 3 powder), the ingredients are Sn42, Bi58, used for mobile phone CPU IC, etc.

. TOPNIK FLUX SFD-231 45g PASTA LUTOWNICZA BGA

. TOPNIK FLUX SFD-231 45g PASTA LUTOWNICZA BGA

. TOPNIK FLUX SFD-231 45g PASTA LUTOWNICZA BGA

Specification:

Item Type: Low Temperature Flux Paste

Model: SFD-231

Composition: Sn42 Bi58

Granules: 25-45um (No.3 powder)

Weight: 45g/Pcs with Tube

Applicable: Mobile phone CPU IC, etc.

Melting Point: 138℃

Material: Tin

. TOPNIK FLUX SFD-231 45g PASTA LUTOWNICZA BGA

. TOPNIK FLUX SFD-231 45g PASTA LUTOWNICZA BGA

. TOPNIK FLUX SFD-231 45g PASTA LUTOWNICZA BGA

Package List:

1 x Low Temperature Flux Paste

. TOPNIK FLUX SFD-231 45g PASTA LUTOWNICZA BGA

. TOPNIK FLUX SFD-231 45g PASTA LUTOWNICZA BGA

. TOPNIK FLUX SFD-231 45g PASTA LUTOWNICZA BGA